India Opportunities in Semiconductor Packaging - Sector Wise Perspective of an OSAT
Held On: 04th December 2021, Saturday
Venue: TechWorldCongress.com
Time: 11:00 - 12:30 Hrs IST
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SPEAKERS
This Session Will Cover
OSAT tech roadmaps are envolving with the focus on
Sectorwise Perspective of an OSAT
- Cost reduction aimed at lowering cost/interconnect
- Yield enhancement with move towards Middle-end-of-line technologies and shifts towards wafer level packaging – and now panel-level packaging.
- Tech enhancements that drive more towards advance systems-in-package architectures.
- This discussion will also explore the opportunity for an OSAT in tapping the Automotive, Fintech, Consumer, Telecom/Power electronics market in India.
- Contextually brings out the potential synergies between
Government, Industry and OSAT for creating the Indian Markets…
OUR PATRONS
